Circuit board, package structure and method of manufacturing the same
US10897823B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2019 |
| Grant date | Jan 19, 2021 |
| Priority date | — |
| Expiry date | Mar 21, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/061
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board including an interconnect substrate and a multilayer structure is provided. The interconnect substrate includes a core layer and a conductive structure disposed on the core layer. The multilayer structure is disposed on the conductive structure. The multilayer structure includes a plurality of dielectric layers and a plurality of circuit structures. The circuit structures are disposed in the dielectric layers. A topmost layer in the circuit structures is exposed to the dielectric layers to be in contact with the conductive structure. A pattern of the topmost layer in the circuit structures and a pattern of a top surface of the conductive structure are engaged with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.