Patent · US Active

Method for detecting wafer processing parameters with micro resonator array sensors

US10901021B2 · kind B2 · utility

0Cited by

3References

19Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Chuang-Chia Lin · Diamond Bar, US
Upendra Ummethala · Cupertino, US

Key dates

Filing date	Feb 22, 2019
Grant date	Jan 26, 2021
Priority date	—
Expiry date	Mar 15, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01Q1/38
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments include systems and methods for determining a processing parameter of a processing operation. Some embodiments include a diagnostic substrate that comprises a substrate, a circuit layer over the substrate, a capping layer over the circuit layer, and a sensing region across the capping layer. In an embodiment, the sensing region comprises, an array of first micro resonators and a second micro resonator. In an embodiment, the array of first micro resonators surround the second micro resonator.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.