Substrate inspection method and substrate inspection device
US10901028B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2017 |
| Grant date | Jan 26, 2021 |
| Priority date | — |
| Expiry date | Jan 4, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/28
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Provided is a substrate inspection method capable of accurately performing inspection. A wafer inspection device includes a chuck top on which a wafer having a semiconductor device formed thereon is mounted and a probe card disposed above the chuck top so as to face the chuck top. The probe card includes a plurality of contact probes protruding toward the wafer. When bringing the chuck top close to the probe card, a tubular expandable/contractible bellows extending downward from the probe card side so as to surround the contact probes is attracted to the chuck top via a lip seal before the contact probes come into contact with the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.