Method of producing an SMD package with top side cooling

US10903133B2 · kind B2 · utility

Assignee

• Infineon Technologies Austria AG · AT

Inventors

• Ralf Otremba · Kaufbeuren, DE
• Markus Dinkel · Unterhaching, DE
• Ulrich Froehler · Nersingen, DE
• Josef Hoeglauer · Munich, DE
• Uwe Kirchner · Feldkirchen in Kärnten, AT
• Guenther Lohmann · Sattendorf, AT
• Klaus Schiess · Allensbach, DE
• Xaver Schloegel · Sachsenkam, DE

Key dates

• Filing date: Jan 8, 2020
• Grant date: Jan 26, 2021
• Expiry date: Jan 8, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L23/49555
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A package encloses a power semiconductor die and has a package body with a top side, footprint side and sidewalls. The die has first and second load terminals and blocks a blocking voltage between the load terminals. The package further includes: a lead frame structure for electrically and mechanically coupling the package to a support, the lead frame structure including an outside terminal extending out of the package footprint side and/or out of one of the package sidewalls and electrically connected with the first load terminal; and a top layer arranged at the package top side and electrically connected with the second load terminal. A heat spreader is mounted onto the top layer with a bottom surface facing the top layer. The area of the top surface of the heat spreader is greater than the area of the bottom surface.