Patent · US Active

Integrated circuit packages

US10903166B2 · kind B2 · utility

4Cited by

0References

25Claims

0Family size

Assignee

Intel IP Corporation · US

Inventors

Sanka Ganesan · Chandler, US
Thorsten Meyer · Regensburg, DE
Gerald Ofner · Regensburg, DE

Key dates

Filing date	Jan 28, 2016
Grant date	Jan 26, 2021
Priority date	—
Expiry date	Apr 27, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3511
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Disclosed herein are integrated circuit (IC) packages, and related structures and techniques. In some embodiments, an IC package may include: a die; a redistribution structure, wherein the die is coupled to the redistribution structure via first-level interconnects and solder; a solder resist; and second-level interconnects coupled to the redistribution structure through openings in the solder resist.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.