Inventor · Regensburg, DE

Gerald Ofner

45Patents
13h-index
50Co-inventors
80Inventor score

Filing activity: Nov 19, 2001 → Oct 23, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US8878360B2 Stacked fan-out semiconductor chip Electricity 58 Active
US9385105B2 Semiconductor devices Electricity 45 Active
US10211182B2 Package-on-package stacked microelectronic structures Electricity 42 Active
US7420262B2 Electronic component and semiconductor wafer, and method for producing the same Electricity 42 Expired
US8183696B2 Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads Electricity 38 Active
US7276783B2 Electronic component with a plastic package and method for production Electricity 37 Expired
US9997444B2 Microelectronic package having a passive microelectronic device disposed within a package body Electricity 37 Active
US6710455B2 Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic component Electricity 30 Expired
US9663353B2 Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC) Electricity 29 Active
US6867471B2 Universal package for an electronic component with a semiconductor chip and method for producing the universal package Electricity 19 Expired
US8716859B2 Enhanced flip chip package Electricity 17 Active
US8741690B2 Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads Electricity 16 Active
US6683374B2 Electronic component and process for producing the electronic component Electricity 15 Expired
US7816235B2 Semiconductor package and method for producing the same Electricity 11 Active
US9543224B1 Hybrid exposure for semiconductor devices Electricity 11 Active
US7994608B2 Magnetically alignable integrated circuit device Electricity 10 Active
US7517722B2 Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds Electricity 10 Active
US8754522B2 Repairable semiconductor device and method Electricity 8 Active
US7045881B2 Electronic component with shielding and method for its production Electricity 6 Expired
US8357565B2 Integrated circuit package and a method for forming an integrated circuit package Electricity 6 Active
US9059304B2 Enhanced flip chip package Electricity 6 Active
US7452747B2 Semiconductor package with contact support layer and method to produce the package Electricity 5 Active
US6940156B2 Electronic module with a semiconductor chip which has flexible chip contacts, and method for producing the electronic module Electricity 4 Expired
US9056763B2 Stress buffer layer for integrated microelectromechanical systems (MEMS) Electricity 4 Active
US10903166B2 Integrated circuit packages Electricity 4 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.