Filler particle position and density manipulation with applications in thermal interface materials
US10903184B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2018 |
| Grant date | Jan 26, 2021 |
| Priority date | — |
| Expiry date | Aug 22, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1443
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal interface material and systems and methods for forming a thermal interface material include depositing a layer of a composite material, including at least a first material and a second material, the first material including a carrier fluid and the second material including a filler particle suspended within the first material. A particle manipulator is positioned over the layer of the composite material, the particle manipulator including at least one emitter to apply a particle manipulating field to bias a movement of the filler particles. The second material is redistributed by applying the particle manipulating field to interact with the second material causing the second material to migrate from a surrounding region in the composite material into a high concentration region in the composite material to form a customized thermal interface such that the high concentration region is configured and positioned corresponding to a hotspot.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.