Methods for separating bonded wafer structures
US10910280B2 · kind B2 · utility
0Cited by
6References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2019 |
| Grant date | Feb 2, 2021 |
| Priority date | — |
| Expiry date | Mar 8, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2457/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Cleave systems for separating bonded wafer structures, mountable cleave monitoring systems and methods for separating bonded wafer structures are disclosed. In some embodiments, the sound emitted from a bonded wafer structure is sensed during cleaving and a metric related to an attribute of the cleave is generated. The generated metric may be used for quality control and/or to adjust a cleave control parameter to improve the quality of the cleave of subsequently cleaved bonded wafer structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.