James Dean Eoff
9Patents
3h-index
18Co-inventors
54Inventor score
Filing activity: Apr 29, 1998 → Sep 13, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6089285A | Method and system for supplying semiconductor source material | Chemistry; Metallurgy | 5 | Expired |
| US11795569B2 | Systems for producing a single crystal silicon ingot using a vaporized dopant | Emerging Cross-Sectional Technologies | 3 | Active |
| US10679908B2 | Cleave systems, mountable cleave monitoring systems, and methods for separating bonded wafer structures | Performing Operations; Transporting | 3 | Active |
| US10910280B2 | Methods for separating bonded wafer structures | Performing Operations; Transporting | 0 | Active |
| US12270768B2 | Method of processing a cleaved semiconductor wafer | Physics | 0 | Active |
| US12019031B2 | Cleaved semiconductor wafer imaging system | Physics | 0 | Active |
| US11866844B2 | Methods for producing a single crystal silicon ingot using a vaporized dopant | Chemistry; Metallurgy | 0 | Active |
| US11499245B2 | Additive feed systems, ingot puller apparatus and methods for forming a single crystal silicon ingot with use of such additive feed systems | Chemistry; Metallurgy | 0 | Active |
| US11921054B2 | Cleaved semiconductor wafer camera system | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.