Systems and methods of gap calibration via direct component contact in electronic device manufacturing systems
US10916451B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2019 |
| Grant date | Feb 9, 2021 |
| Priority date | — |
| Expiry date | Aug 7, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/687
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device manufacturing system includes a motion control system for calibrating a gap between surfaces of process chamber or loadlock components by moving those component surfaces into direct contact with each other. The component surfaces may include a surface of a substrate and/or a substrate support and a surface of process delivery apparatus, which may be, e.g., a pattern mask and/or a plasma or gas distribution assembly. The motion control system may include a motion controller, a software program executable by the motion controller, a network, one or more actuator drivers, a software program executable by the one or more actuator drivers, one or more actuators, and one or more feedback devices. Methods of calibrating a gap via direct contact of process chamber or loadlock component surfaces are also provided, as are other aspects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.