Patent · US Active

Methods for producing packaged semiconductor devices

US10923364B2 · kind B2 · utility

0Cited by

2References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Kristina Mayer · Regensburg, DE
Michael Ledutke · Ribnitz-Damgarten, DE
Johannes Lodermeyer · Kinding, DE

Key dates

Filing date	Aug 31, 2018
Grant date	Feb 16, 2021
Priority date	—
Expiry date	Feb 2, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3511
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method comprises: arranging a plurality of semiconductor chips above a carrier, wherein active main surfaces of the semiconductor chips face the carrier; filling a cavity with a molding material; pressing the semiconductor chips arranged on the carrier into the molding material; and separating the molding material with the semiconductor chips embedded therein from the carrier, wherein main surfaces of the semiconductor chips that are situated opposite the active main surfaces are covered by the molding material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.