Bifurcated memory die module semiconductor device
US10923462B2 · kind B2 · utility
4Cited by
7References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2018 |
| Grant date | Feb 16, 2021 |
| Priority date | — |
| Expiry date | Jun 28, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is disclosed including one or more integrated memory modules. Each integrated memory module may include a pair of semiconductor die, which together, operate as a single, integrated memory. In one example, the first die may include the memory cell array and the second die may include the logic circuit such as CMOS integrated circuits. In one example, the first die may be flip-chip bonded to the second die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.