Gokul Kumar
9Patents
4h-index
19Co-inventors
43Inventor score
Filing activity: Oct 6, 2016 → Dec 20, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10381327B2 | Non-volatile memory system with wide I/O memory die | Electricity | 65 | Active |
| US10522489B1 | Manufacturing process for separating logic and memory array | Electricity | 15 | Active |
| US9899347B1 | Wire bonded wide I/O semiconductor device | Electricity | 6 | Active |
| US10923462B2 | Bifurcated memory die module semiconductor device | Electricity | 4 | Active |
| US10468073B2 | Transmission line optimization for multi-die systems | Electricity | 3 | Active |
| US10483239B2 | Semiconductor device including dual pad wire bond interconnection | Electricity | 2 | Active |
| US10637533B2 | Dedicated termination dies for memory systems | Electricity | 2 | Active |
| US10249592B2 | Wire bonded wide I/O semiconductor device | Electricity | 1 | Active |
| US10930607B2 | Manufacturing process for separating logic and memory array | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.