Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device
US10925170B2 · kind B2 · utility
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25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2018 |
| Grant date | Feb 16, 2021 |
| Priority date | — |
| Expiry date | Apr 10, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12431
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a surface treated copper foil in which a dropping of the roughening particles from a roughening treatment layer provided on the surface of the copper foil is favorably suppressed and an occurrence of wrinkles or stripes when bonding with an insulating substrate is favorably suppressed.The surface treated copper foil comprises a copper foil, and
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.