Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, heat dissipation substrate, and method for manufacturing electronic device
US10925171B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2018 |
| Grant date | Feb 16, 2021 |
| Priority date | — |
| Expiry date | Jun 2, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12431
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a surface treated copper foil in which a dropping of the roughening particles from a roughening treatment layer on the surface of the copper foil is suppressed and an occurrence of wrinkles or stripes when bonding with an insulating substrate is suppressed. The surface of the roughening treatment layer satisfies one or more of the following: a roughness Ra is 0.08 to 0.20 μm, a roughness Rz is 1.00 to 2.00 μm, a roughness Sq is 0.16 to 0.30 μm, a roughness Ssk is −0.6 to −0.35, a roughness Sa is 0.12 to 0.23 μm, a roughness Sz is 2.20 to 3.50 μm, a roughness Sku is 3.75 to 4.50, and a roughness Spk is 0.13 to 0.27 μm, a glossiness of a TD of the surface of the side of the roughening treatment layer of the surface treated copper foil is 70% or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.