Method of inspecting a specimen and system thereof
US10928437B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2019 |
| Grant date | Feb 23, 2021 |
| Priority date | — |
| Expiry date | Sep 25, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/303
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Data indicative of location information of a potential defect of interest revealed in a specimen and of one or more layers of the specimen corresponding to the potential defect of interest may be received. A die layout clip may be generated in accordance with the data by deriving the die layout clip based on the location information of the potential defect of interest and the one or more layers of the specimen corresponding to the potential defect of interest. The die layout clip may include information indicative of one or more patterns characterizing an inspection area that includes the potential defect of interest of the specimen. The generated die layout clip may be transmitted to a semiconductor inspection unit where an inspection by the semiconductor inspection unit of a semiconductor wafer that includes the specimen corresponding to the potential defect of interest is based on the one or more patterns of the die layout clip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.