Using sacrificial solids in semiconductor processing
US10937644B2 · kind B2 · utility
0Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2019 |
| Grant date | Mar 2, 2021 |
| Priority date | — |
| Expiry date | Jul 9, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67745
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an example, a method may include closing an opening in a structure with a sacrificial material at a first processing tool, moving the structure from the first processing tool to a second processing tool while the opening is closed, and removing the sacrificial material at the second processing tool. The structure may be used in semiconductor devices, such as memory devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.