Semiconductor device package and method for manufacturing the same
US10937761B2 · kind B2 · utility
3Cited by
73References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2019 |
| Grant date | Mar 2, 2021 |
| Priority date | — |
| Expiry date | Dec 10, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.