Method for removing photosensitive material on a substrate
US10948825B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2016 |
| Grant date | Mar 16, 2021 |
| Priority date | — |
| Expiry date | Jul 18, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/2053
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of processing a substrate includes: providing a substrate with a layer of photosensitive material on a surface of the substrate; and removing at least part of the photosensitive material from around an outer edge of the layer of photosensitive material so as to generate an edge, having a radial width, around the layer of photosensitive material remaining on the surface of the substrate, wherein the photosensitive material varies in thickness forming a thickness profile across the radial width and the removing is controlled so as to generate variation in the thickness profile along the length of the edge, and/or wherein the removing is controlled so as to generate a rough edge around the layer of photosensitive material remaining on the surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.