Electronic package, method for fabricating the same, and heat dissipator
US10950520B2 · kind B2 · utility
0Cited by
15References
27Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 6, 2019 |
| Grant date | Mar 16, 2021 |
| Priority date | — |
| Expiry date | Aug 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package is provided. A heat dissipator is bonded via a thermal interface layer to an electronic component disposed on a carrier. The heat dissipator has a concave-convex structure to increase a heat-dissipating area of the thermal interface layer. Therefore, the heat dissipator has a better heat-dissipating effect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.