Method for deterministic finishing of a chuck surface
US10953513B2 · kind B2 · utility
0Cited by
7References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 10, 2016 |
| Grant date | Mar 23, 2021 |
| Priority date | — |
| Expiry date | Oct 12, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23B2231/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a deterministic setting for finishing the support surface of a chuck such as a wafer chuck, the treatment tool may have a contacting surface shaped as a ring, annulus, or toroid, or at least such will be the form of contact when the treatment tool is brought into contact with a flat surface. The treatment tool may have about the same hardness as the work piece (e.g., the wafer chuck) that is being finished. In one embodiment, the treatment tool, or at least the flat contacting surface, is made from silicon carbide (SiC), or contains SiC, for example, in the form of a composite material such as reaction-bonded SiC.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.