Method for bonding by direct adhesion

US10957539B2 · kind B2 · utility

Assignee

• COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

• Frank Fournel · Meylan, FR
• Vincent Larrey · La Murette, FR
• Christophe Morales · Le Pont-de-Claix, FR
• Marwan Tedjini · Fontaine, FR

Key dates

• Filing date: Dec 3, 2018
• Grant date: Mar 23, 2021
• Expiry date: Feb 24, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67092
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A process includes the successive steps of: a) providing first and second substrates, each including a first surface and an opposite, second surface, lateral edges connecting the first and second surfaces, b) bonding the first substrate to the second substrate by direct bonding with the first surfaces of the first and second substrates so as to form a bonding interface (IC), and making the lateral edges of the first and second substrates hydrophobic on either side of the bonding interface (IC).