Spatially localized thermal interface materials
US10957622B2 · kind B2 · utility
0Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2019 |
| Grant date | Mar 23, 2021 |
| Priority date | — |
| Expiry date | Apr 29, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device that includes a semiconductor substrate having a surface, the surface having several regions having different thermal and/or mechanical requirements; and a composite thermal interface material including several spatially localized thermal interface materials placed on the surface, each of the several thermal interface materials tailored to the different thermal and/or mechanical requirements of each of the regions. Also disclosed is a method of forming the composite thermal interface material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.