Patent · US Active

Device and method for bonding of two substrates

US10964562B2 · kind B2 · utility

3Cited by

5References

11Claims

0Family size

Assignee

EV GROUP E. THALLNER GMBH · AT

Inventors

Markus Wimplinger · Ried im Innkreis, AT
Florian Kurz · Ried im Innkreis, AT
Viorel Dragoi · Ried im Innkreis, AT

Key dates

Filing date	Sep 29, 2016
Grant date	Mar 30, 2021
Priority date	—
Expiry date	Jun 11, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/68735
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A device, a system and a method for bonding two substrates. A first substrate holder has a recess and an elevation.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.