Process for creating piezo-electric mirrors in package
US10969574B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2016 |
| Grant date | Apr 6, 2021 |
| Priority date | — |
| Expiry date | Jan 13, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/87
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Embodiments of the invention include a piezo-electric mirror in an microelectronic package and methods of forming the package. According to an embodiment the microelectronic package may include an organic substrate with a cavity formed in the organic substrate. In some embodiments, an actuator is anchored to the organic substrate and extends over the cavity. For example, the actuator may include a first electrode and a piezo-electric layer formed on the first electrode. A second electrode may be formed on the piezo-electric layer. Additionally, a mirror may be formed on the actuator. Embodiments allow for the piezo-electric layer to be formed on an organic package substrate by using low temperature crystallization processes. For example, the piezo-electric layer may be deposited in an amorphous state. Thereafter, a laser annealing process that includes a pulsed laser may be used to crystallize the piezo-electric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.