Measurement and endpointing of sample thickness
US10978272B2 · kind B2 · utility
4Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2019 |
| Grant date | Apr 13, 2021 |
| Priority date | — |
| Expiry date | Sep 23, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31749
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention relates to a method of determining the thickness of a sample. According to this method, a diffraction pattern image of a sample of a first material is obtained. Said diffraction pattern image comprises at least image values representative for the diffraction pattern obtained for said sample. A slope of said image values is then determined. The slope is compared to a relation between the thickness of said first material and the slope of image value of a corresponding diffraction pattern image of said first material. The determined slope and said relation are used to determine the thickness of said sample.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.