Multi integrated circuit chip carrier package

US10978314B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Marcus E. Interrante · Highland, US
• Kathryn R. Lange · Marlboro, US
• Kamal K. Sikka · Poughkeepsie, US
• Tuhin Sinha · Oradell, US
• Hilton T. Toy · Hopewell Junction, US
• Jeffrey A. Zitz · Poughkeepsie, US

Key dates

• Filing date: Oct 3, 2019
• Grant date: Apr 13, 2021
• Expiry date: Oct 3, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/73253
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A multi integrated circuit (IC) chip package includes multiple IC chips, a carrier, and a lid. The IC chips may be connected to the carrier. Alternatively, each IC chip may be connected to an interposer and multiple interposers may be connected to the carrier. The carrier may be positioned against a carrier deck. The lid may be positioned relative to carrier by aligning one or more alignment features within the lid with one or more respective alignment features of the carrier deck. A compression fixture cover may contact the lid and exert a force toward the carrier deck, the lid be loaded against respective IC chips, and the lid may be loaded against the carrier. While under compression, thermal interface material between respective the lid and respective IC chips and seal band material between the lid and the carrier may be cured.