Semiconductor device methods of manufacture
US10978373B2 · kind B2 · utility
2Cited by
10References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2019 |
| Grant date | Apr 13, 2021 |
| Priority date | — |
| Expiry date | Mar 1, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a vapor chamber lid for high power applications such as chip-on-wafer-on-substrate (CoWoS) applications using high performance processors (e.g., graphics processing unit (GPU)) and methods of manufacturing the same. The vapor chamber lid provides a thermal solution which enhances the thermal performance of a package with multiple chips. The vapor chamber lid improves hot spot dissipation in high performance chips, for example, at the three-dimensional (3D-IC) packaging level.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.