Inventor · Taipei, TW

Hung-Chi Li

14Patents

3h-index

15Co-inventors

49Inventor score

Filing activity: Feb 16, 2017 → Apr 28, 2024

Most-cited inventions

Patent	Title	Area	Cited by	Status
US10461014B2	Heat spreading device and method	Electricity	7	Active
US10515867B2	Semiconductor structure and manufacturing method thereof	Electricity	4	Active
US10475877B1	Multi-terminal inductor for integrated circuit	Electricity	3	Active
US11594469B2	Semiconductor device and method of manufacture	Electricity	2	Active
US10978373B2	Semiconductor device methods of manufacture	Electricity	2	Active
US10672860B2	Multi-terminal inductor for integrated circuit	Electricity	1	Active
US11088048B2	Semiconductor structure	Electricity	1	Active
US11018073B2	Heat spreading device and method	Electricity	1	Active
US10153218B2	Semiconductor structure and manufacturing method thereof	Electricity	1	Active
US12412805B2	Semiconductor package	Electricity	0	Active
US11282766B2	Package structure	Electricity	0	Active
US10879342B2	Multi-terminal inductor for integrated circuit	Electricity	0	Active
US11587845B2	Semiconductor structure	Electricity	0	Active
US11996342B2	Semiconductor package comprising heat dissipation plates	Electricity	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.