Fluid distributing device for a thin-film deposition apparatus, related apparatus and methods
US10982325B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2020 |
| Grant date | Apr 20, 2021 |
| Priority date | — |
| Expiry date | Sep 23, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N60/0436
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A thin-film deposition apparatus, related systems and methods are provided. The thin-film deposition apparatus 200 comprises a reaction chamber 201 for accommodating substrates 10 arranged with their side faces adjacent to each other and a fluid distribution device 100 with an expansion region 101 into which precursor fluid(s) enter via a number of inlets 103, and a transition region 102 for mixing said fluids. From the transition region, fluidic flow is directed into the reaction chamber 201 to propagate between the substrates 10 in a strictly laminar manner. By the invention, uniformity of precursor distribution on the substrates can be markedly improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.