Substrate cleaning apparatus, substrate cleaning method, and control method of substrate cleaning apparatus
US10985037B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2018 |
| Grant date | Apr 20, 2021 |
| Priority date | — |
| Expiry date | Apr 18, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68728
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various examples regarding substrate cleaning apparatus and methods, and related apparatus and method are disclosed. According to one embodiment, provided is a substrate cleaning apparatus including: a substrate holding and rotating module; an elongated cleaning member configured to come into contact with the substrate while the substrate is held and rotated by the substrate holding and rotating module; and a first nozzle and a second nozzle, both of which are arranged on an identical side with respect to a longitudinal direction of the cleaning member, wherein the first nozzle is operably adjusted to supply liquid more forcefully than liquid from the second nozzle, and the first nozzle is arranged so that the liquid from the first nozzle is reached to a first area located closer to the first nozzle than the cleaning member in the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.