Patent · US Active

Method and apparatus for use in wafer processing

US10985041B2 · kind B2 · utility

0Cited by

3References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thomas Fischer · Umkirch, DE
Gerald Lackner · Arnoldstein, AT
Walter Leitgeb · Wernberg, AT
Michael Lecher · Villach, AT

Key dates

Filing date	Dec 14, 2018
Grant date	Apr 20, 2021
Priority date	—
Expiry date	Dec 14, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/67092
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method and apparatus for use in a wafer processing are disclosed. In an embodiment a includes providing the wafer on a receptacle, wherein the receptacle comprises a light port, and wherein the light port includes a source of light, shining a light from the source of light at an edge of the wafer thereby passing light by the edge of the wafer and processing the wafer on the receptacle based on the light passing by the edge of the wafer and received by a light sensitive element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.