Micro-LED transfer methods using light-based debonding
US10985046B2 · kind B2 · utility
3Cited by
0References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2019 |
| Grant date | Apr 20, 2021 |
| Priority date | — |
| Expiry date | Jul 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Transfer methods disclosed herein include transferring micro-LEDs from a first carrier to a second carrier. The methods include bonding the micro-LEDs to the first carrier using a first releasable bonding layer that releases when exposed to actinic light. The micro-LEDs are then secured to a second carrier. The first bonding layer is then irradiated through the first releasable bonding layer through the first carrier with the actinic light to release the micro-LEDs from the first carrier. The second carrier can be a display backplane having bonding pads and the micro-LEDs can be secured to the bonding pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.