Patent · US Active

Electronic package that includes lamination layer

US10985080B2 · kind B2 · utility

0Cited by

1References

18Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Pramod Malatkar · Chandler, US
Kyle Yazzie · San Tan Valley, US
Naga Sivakumar Yagnamurthy · Chandler, US
Richard J. Harries · Chandler, US
Dilan Seneviratne · Chandler, US
Praneeth Akkinepally · Tempe, US
Xuefei Wan · Chandler, US
Yonggang Li · Chandler, US
Robert L. Sankman · Phoenix, US

Key dates

Filing date	Nov 24, 2015
Grant date	Apr 20, 2021
Priority date	—
Expiry date	Dec 6, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3511
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic package that includes a substrate and an electronic component attached to the substrate. A laminated layer is attached to an upper surface of the substrate such that the laminated layer covers the electronic component. The electronic package may further include a stiffener mounted on the laminated layer where the stiffener is over the electronic component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.