Carbon-based direct plating process
US10986738B2 · kind B2 · utility
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13References
16Claims
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Key dates
| Filing date | May 8, 2018 |
| Grant date | Apr 20, 2021 |
| Priority date | — |
| Expiry date | Jan 8, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0763
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of preparing a non-conductive substrate to allow metal plating thereon. The method includes the steps of a) contacting the non-conductive substrate with a conditioner comprising a conditioning agent; b) applying a carbon-based dispersion to the conditioned substrate, wherein the carbon-based dispersion comprises carbon or graphite particles dispersed in a liquid solution; and c) etching the non-conductive substrate. The etching step is performed before the liquid carbon-based dispersion dries on the non-conductive substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.