Patent · US Active

Computational metrology

US10990018B2 · kind B2 · utility

5Cited by
5References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 12, 2018
Grant dateApr 27, 2021
Priority date
Expiry dateFeb 12, 2038

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG06F2119/22
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

A method, involving determining a first distribution of a first parameter associated with an error or residual in performing a device manufacturing process; determining a second distribution of a second parameter associated with an error or residual in performing the device manufacturing process; and determining a distribution of a parameter of interest associated with the device manufacturing process using a function operating on the first and second distributions. The function may include a correlation.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.