Process chamber and substrate processing apparatus including the same
US10991600B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2017 |
| Grant date | Apr 27, 2021 |
| Priority date | — |
| Expiry date | Nov 11, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67201
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process chamber and a substrate processing apparatus including the same are disclosed. The process chamber includes a first housing and a second housing on the first housing. The first housing includes a first outer wall, a first partition wall facing the first outer wall, and a first side wall connecting the first outer wall and the first partition wall. The second housing includes a second outer wall, a second partition wall between the second outer wall and the first partition wall, and a second side wall connecting the second outer wall and the second partition wall. Each of the first and second outer walls has a thickness greater than a thickness of the first partition wall and a thickness of the second partition wall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.