Substrate cleaning composition, substrate treating method, and substrate treating apparatus
US11004675B2 · kind B2 · utility
1Cited by
0References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2018 |
| Grant date | May 11, 2021 |
| Priority date | — |
| Expiry date | Feb 17, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are an anhydrous substrate cleaning composition, a substrate treating method, and a substrate treating apparatus. The anhydrous substrate cleaning composition includes an etching composite that provides fluorine, a solvent that dissolves the etching composite, and a binder that is a composite including phosphorous.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.