Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods
US11004697B2 · kind B2 · utility
1Cited by
6References
15Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 10, 2019 |
| Grant date | May 11, 2021 |
| Priority date | — |
| Expiry date | Jun 10, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a substrate including traces, wherein the traces protrude above a top surface of the substrate; a prefill material over the substrate and between the traces, wherein the prefill material directly contacts peripheral surfaces of the traces; a die attached over the substrate; and a wafer-level underfill between the prefill material and the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.