Apparatus and method for the minimization of undercut during a UBM etch process
US11004755B2 · kind B2 · utility
1Cited by
4References
25Claims
0Family size
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Key dates
| Filing date | Jun 20, 2019 |
| Grant date | May 11, 2021 |
| Priority date | — |
| Expiry date | Jun 20, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/741
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor etch process is provided in which an undercut is minimized during an etch process through tight control of etch profile, recognition of etch completion, and minimization of over etch time to increase productivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.