John Taddei
21Patents
2h-index
26Co-inventors
53Inventor score
Filing activity: Feb 28, 2013 → Apr 5, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9541837B2 | Apparatus and method for removing challenging polymer films and structures from semiconductor wafers | Electricity | 5 | Active |
| US9698062B2 | System and method for performing a wet etching process | Electricity | 3 | Active |
| US10559488B2 | Two-level tape frame rinse assembly | Electricity | 2 | Active |
| US10707099B2 | Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle | Performing Operations; Transporting | 2 | Active |
| US10413850B2 | Apparatus and method to remove solids from material lift off post process solvents | Electricity | 1 | Active |
| US11342215B2 | Semiconductor wafer processing chamber | Electricity | 1 | Active |
| US11004755B2 | Apparatus and method for the minimization of undercut during a UBM etch process | Electricity | 1 | Active |
| US10239031B2 | Apparatus and method for mixing fluids with degradational properties | Performing Operations; Transporting | 0 | Active |
| US12354503B2 | Signage fastener | Physics | 0 | Active |
| US10294132B2 | Apparatus and method to reduce and control resistivity of deionized water | Chemistry; Metallurgy | 0 | Active |
| US10446387B2 | Apparatus and method to control etch rate through adaptive spiking of chemistry | Electricity | 0 | Active |
| US9333446B2 | Apparatus and method to remove undissolved solids from post process dry film strip solvents | Performing Operations; Transporting | 0 | Active |
| US10541180B2 | Apparatus and method for wafer thinning in advanced packaging applications | Electricity | 0 | Active |
| US10443943B2 | Apparatus and method to control properties of fluid discharge via refrigerative exhaust | Mechanical Engineering; Lighting; Heating | 0 | Active |
| US11069583B2 | Apparatus and method for the minimization of undercut during a UBM etch process | Electricity | 0 | Active |
| US10026660B2 | Method of etching the back of a wafer to expose TSVs | Electricity | 0 | Active |
| US11232958B2 | System and method for self-cleaning wet treatment process | Electricity | 0 | Active |
| US11756805B2 | Apparatus and method for die stack flux removal | Electricity | 0 | Active |
| US9694436B2 | System and method for flux coat, reflow and clean | Performing Operations; Transporting | 0 | Active |
| US10553502B2 | Two etch method for achieving a wafer thickness profile | Electricity | 0 | Active |
| US10503182B2 | Apparatus and method for metals free reduction and control of resistivity of deionized water | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.