Semiconductor device assemblies
US11004777B2 · kind B2 · utility
0Cited by
0References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2019 |
| Grant date | May 11, 2021 |
| Priority date | — |
| Expiry date | Jun 28, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18301
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one general aspect, an apparatus can include a leadframe including a plurality of leads configured to provide electrical connections for the apparatus. The apparatus can also include a semiconductor die disposed on the leadframe and a conductive clip electrically coupling the semiconductor die with the leadframe. The apparatus can further include a heat slug disposed on the conductive clip. The heat slug can include a thermally conductive and electrically insulative material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.