Package structure and method of forming the same
US11004786B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2019 |
| Grant date | May 11, 2021 |
| Priority date | — |
| Expiry date | Mar 15, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure includes a die, a TIV, a first encapsulant, a RDL structure, a thermal dissipation structure and a second encapsulant. The die has a first surface and a second surface opposite to each other. The TIV is laterally aside the die. The first encapsulant encapsulates sidewalls of the die and sidewalls of the TIV. The RDL structure is disposed on the first surface of the die and on the first encapsulant, electrically connected to the die and the TIV. The thermal dissipation structure is disposed over the second surface of die and electrically connected to the die through the TIV and the RDL structure. The second encapsulant encapsulates sidewalls of the thermal dissipation structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.