Printing chemical mechanical polishing pad having window or controlled porosity
US11007618B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2018 |
| Grant date | May 18, 2021 |
| Priority date | — |
| Expiry date | Aug 4, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y50/02
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of fabricating a polishing pad includes determining a desired distribution of voids to be introduced within a polymer matrix of a polishing layer of the polishing pad. Electronic control signals configured to be read by a 3D printer are generated which specify the locations where a polymer matrix precursor is to be deposited, and specify the locations of the desired distribution of voids where no material is to be deposited. A plurality of layers of the polymer matrix corresponding to the plurality of the first locations is successfully deposited with the 3D printer. Each layer of the plurality of layers of polymer matrix is deposited by ejecting a polymer matrix precursor from a nozzle. The polymer matrix precursor is solidified to form a solidified polymer matrix having the desired distribution of voids.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.