Laxman Murugesh
23Patents
13h-index
30Co-inventors
81Inventor score
Filing activity: Aug 15, 1994 → Apr 19, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5937323A | Sequencing of the recipe steps for the optimal low-k HDP-CVD processing | Electricity | 861 | Expired |
| US6217658A | Sequencing of the recipe steps for the optimal low-dielectric constant HDP-CVD Processing | Electricity | 794 | Expired |
| US6450117B1 | Directing a flow of gas in a substrate processing chamber | Emerging Cross-Sectional Technologies | 490 | Expired |
| US6136685A | High deposition rate recipe for low dielectric constant films | Electricity | 295 | Expired |
| US5994662A | Unique baffle to deflect remote plasma clean gases | Electricity | 50 | Expired |
| US9993907B2 | Printed chemical mechanical polishing pad having printed window | Performing Operations; Transporting | 34 | Active |
| US5811356A | Reduction in mobile ion and metal contamination by varying season time and bias RF power during chamber cleaning | Emerging Cross-Sectional Technologies | 32 | Expired |
| US6200911A | Method and apparatus for modifying the profile of narrow, high-aspect-ratio gaps using differential plasma power | Electricity | 30 | Expired |
| US5756222A | Corrosion-resistant aluminum article for semiconductor processing equipment | Emerging Cross-Sectional Technologies | 25 | Expired |
| US5811195A | Corrosion-resistant aluminum article for semiconductor processing equipment | Emerging Cross-Sectional Technologies | 23 | Expired |
| US5810937A | Using ceramic wafer to protect susceptor during cleaning of a processing chamber | Chemistry; Metallurgy | 19 | Expired |
| US8617672B2 | Localized surface annealing of components for substrate processing chambers | Emerging Cross-Sectional Technologies | 18 | Active |
| US7732056B2 | Corrosion-resistant aluminum component having multi-layer coating | Chemistry; Metallurgy | 18 | Expired |
| US5997685A | Corrosion-resistant apparatus | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6159333A | Substrate processing system configurable for deposition or cleaning | Emerging Cross-Sectional Technologies | 12 | Expired |
| US6579811B2 | Method and apparatus for modifying the profile of narrow, high-aspect-ratio gaps through wafer heating | Electricity | 10 | Expired |
| US6228781A | Sequential in-situ heating and deposition of halogen-doped silicon oxide | Electricity | 10 | Expired |
| US6375744B2 | Sequential in-situ heating and deposition of halogen-doped silicon oxide | Electricity | 7 | Expired |
| US7431772B2 | Gas distributor having directed gas flow and cleaning method | Chemistry; Metallurgy | 5 | Expired |
| US7135426B2 | Erosion resistant process chamber components | Chemistry; Metallurgy | 4 | Expired |
| US9481608B2 | Surface annealing of components for substrate processing chambers | Emerging Cross-Sectional Technologies | 4 | Active |
| US6878214B2 | Process endpoint detection in processing chambers | Emerging Cross-Sectional Technologies | 3 | Expired |
| US11007618B2 | Printing chemical mechanical polishing pad having window or controlled porosity | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.