Measurement system, lithographic apparatus and device manufacturing method
US11009800B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2017 |
| Grant date | May 18, 2021 |
| Priority date | — |
| Expiry date | Dec 18, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70875
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A measurement system to determine a deformation of an object having a front surface, a back surface and a pattern. The measurement system includes a processor system and an interferometer system. The interferometer system has a radiation source and a detector system. The source is configured to emit, to each of a plurality of locations on the object, measurement beams in order to generate, at each of the respective plurality of locations, reflected measurement beams off the front and back surfaces of the object respectively. The detector system is configured to receive the respective reflected measurement beams and output signals representative of the received reflected measurement beams to the processor system. The processor system is configured to receive the signals; determine, based on the signals as received, a characteristic of the object; and determine a deformation of the pattern based on the characteristic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.