Modular microjet cooling of packaged electronic components
US11018077B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 9, 2020 |
| Grant date | May 25, 2021 |
| Priority date | — |
| Expiry date | Apr 9, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20927
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention generally relates to a modular microjet cooler. The modular microjet cooler may be attached to a packaged heat generating device that is mounted on a printed circuit board. The modular microjet cooler has an inlet allowing supply fluid to be directed through microjet nozzles toward an impingement surface on the packaged device. The modular microjet cooler also has one or more outlets that allow exhaust fluid to be removed. The modular microjet cooler is attached to the device after it has been packaged. Further, the modular microjet cooler may be attached to the packaged device either before or after it is mounted to the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.