Three-dimensional nanoribbon-based logic
US11018264B1 · kind B1 · utility
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Key dates
| Filing date | Dec 16, 2019 |
| Grant date | May 25, 2021 |
| Priority date | — |
| Expiry date | Dec 16, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/0167
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Described herein are three-dimensional nanoribbon-based logic ICs that include one of more of 1) individual gate control in a vertical stack of nanoribbons, 2) inter-ribbon interconnects in a vertical stack of nanoribbons, and 3) both P- and N-type nanoribbons in a vertical stack of nanoribbons. Using one or more of these features may help realize unique monolithic 3D logic architectures that were not possible with conventional logic circuits and may allow realizing logic devices with favorable metrics in terms of power and performance while preserving the substrate area and cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.