Testing apparatus
US11022643B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2019 |
| Grant date | Jun 1, 2021 |
| Priority date | — |
| Expiry date | Jan 16, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2867
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A testing apparatus includes a chip carrying device and a pressing device. The chip carrying device includes a circuit board and a plurality of electrically connecting units disposed on the circuit board. Each electrically connecting unit includes a main body disposed on the circuit board to form an accommodating slot, a lift structure partially arranged in the accommodating slot. A portion of the lift structure having a chip receiving slot passes through an opening of the main body. The pressing device includes a temperature conditioner being controllable to increase or decrease temperature. When the lift structure is pressed by a flat structure of the temperature conditioner, the probe assemblies are connected to one side of a chip received in the chip receiving slot, and the flat contacting surface is abutted against another side of the chip for transmitting heat energy there-between.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.