Mark position determination method
US11022896B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2017 |
| Grant date | Jun 1, 2021 |
| Priority date | — |
| Expiry date | Feb 15, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F9/7092
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Corrections are calculated for use in controlling a lithographic apparatus. Using a metrology apparatus a performance parameter is measured at sampling locations across one or more substrates to which a lithographic process has previously been applied. A process model is fitted to the measured performance parameter, and an up-sampled estimate is provided for process-induced effects across the substrate. Corrections are calculated for use in controlling the lithographic apparatus, using an actuation model and based at least in part on the fitted process model. For locations where measurement data is available, this is added to the estimate to replace the process model values. Thus, calculation of actuation corrections is based on a modified estimate which is a combination of values estimated by the process model and partly on real measurement data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.